Skip to main content

Quik-Pak Acquires Wafer-Preparation Firm QBBS

Written by Customer Service on . Posted in Mergers And Acquisitions.

SAN DIEGO, Calif., Nov. 25, 2019 (GLOBE NEWSWIRE) — Quik-Pak, a provider of innovative microelectronic packaging and assembly solutions, today announced it has acquired Santa Clara-based QBBS to broaden its portfolio of wafer-preparation services. The addition of QBBS’s automated backgrinding capability will enable Quik-Pak to process customer wafers in larger volumes. The deal was finalized on November 1, and Quik-Pak will integrate the QBBS technology into its wafer prep line in early January.
The QBBS technology will allow Quik-Pak to perform automated, volume backgrinding of a cassette containing up to 25 whole wafers, from 100mm to 200mm (4 to 8 inches) in diameter, as well as partial wafers and 300mm (12-inch) quartered wafers. Quik-Pak will continue to offer its existing backgrinding services, including thinning wafers as large as 300mm in diameter down to 75 microns, and wafers up to 200mm down to 25 microns (about a third the width of a human hair).“This acquisition is highly complementary to our existing wafer thinning, dicing and die inspection business,” said Quik-Pak Chief Operating Officer Ken Molitor. “We have had a relationship with QBBS for many years, tapping them to accommodate customers who needed volume backgrinding services. Being able to deliver this capability directly will greatly enhance our customer relationships and allow us to broaden our market reach.”“Selling the business to Quik-Pak was the right decision at the right time,” noted Carmen Perry, QBBS founder and CEO. “We sought an appropriate exit strategy, and Quik-Pak is on a strong growth path. Our technology and customer base are an excellent fit, and I’m pleased that we were able to strike a mutually beneficial agreement with our longtime partner and proven industry leader.”According to market research firm Mordor Intelligence, the global market for thin wafer processing and dicing equipment reached US$504.3 million in 2018, and is expected to increase at a CAGR of 6.44 percent between 2019 and 2024. Factors driving the growth in demand for these back-end packaging services include the heightened use of RFID chips in consumer, industrial and other electronics applications and the rapid upsurge in IoT and connected devices.About Quik-Pak
Quik-Pak, a division of Promex Industries, provides IC packaging, assembly and wafer preparation services in its ISO 9001:2015-certified, ITAR-registered facility in San Diego, Calif. The company’s over-molded QFN/DFN packages and pre-molded air cavity QFN packages provide a fast, convenient solution for prototype to full production needs. Same-day assembly services are provided to reduce time to market. More information is available at http://www.quik-pak.com or by calling 858-674-4676.

Disclaimer & Cookie Notice

Welcome to GOLDEA services for Professionals

Before you continue, please confirm the following:

Professional advisers only

I am a professional adviser and would like to visit the GOLDEA CAPITAL for Professionals website.

Important Notice for Investors:

The services and products offered by Goldalea Capital Ltd. are intended exclusively for professional market participants as defined by applicable laws and regulations. This typically includes institutional investors, qualified investors, and high-net-worth individuals who have sufficient knowledge, experience, resources, and independence to assess the risks of trading on their own.

No Investment Advice:

The information, analyses, and market data provided are for general information purposes only and do not constitute individual investment advice. They should not be construed as a basis for investment decisions and do not take into account the specific investment objectives, financial situation, or individual needs of any recipient.

High Risks:

Trading in financial instruments is associated with significant risks and may result in the complete loss of the invested capital. Goldalea Capital Ltd. accepts no liability for losses incurred as a result of the use of the information provided or the execution of transactions.

Sole Responsibility:

The decision to invest or not to invest is solely the responsibility of the investor. Investors should obtain comprehensive information about the risks involved before making any investment decision and, if necessary, seek independent advice.

No Guarantees:

Goldalea Capital Ltd. makes no warranties or representations as to the accuracy, completeness, or timeliness of the information provided. Markets are subject to constant change, and past performance is not a reliable indicator of future results.

Regional Restrictions:

The services offered by Goldalea Capital Ltd. may not be available to all persons or in all countries. It is the responsibility of the investor to ensure that they are authorized to use the services offered.

Please note: This disclaimer is for general information purposes only and does not replace individual legal or tax advice.